- wafer-bonding
- основанный на склеивании плат
English-Russian household appliances. 2013.
wafer-bonding
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Wafer (electronics) — Polished 12 and 6 silicon wafers. The flat cut into the right wafer indicates its doping and crystallographic orientation (see below) … Wikipedia
Wafer dicing — is the process by which individual silicon chips or integrated circuits on a silicon wafer are separated following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing (normally with a … Wikipedia
Direct bonding — describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between two surfaces of any material possible meeting numerous requirements.[1] These requirements are specified for the… … Wikipedia
Optical contact bonding — is a glueless process whereby two closely conformal surfaces are joined together, being held purely by intermolecular forces. Contents 1 History 2 Explanation 3 Production of an optical contact bond 4 … Wikipedia
Three-dimensional integrated circuit — In electronics, a three dimensional integrated circuit (3D IC, 3D IC, or 3 D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor… … Wikipedia
Nasiri-Fabrication — Process The Nasiri Fabrication Process, patented by InvenSense, uses a wafer to wafer bonding process that allows for direct integration of the fabricated MEMS wafers to any off the shelf CMOS wafer at the wafer level. Although the wafer bonding… … Wikipedia
Semiconductor device fabrication — Semiconductor manufacturing processes 10 µm 1971 3 µm 1975 1.5 µm 1982 … Wikipedia
EV Group — (EVG) ist ein Hersteller von Prozessanlagen für die Halbleiterindustrie, Mikrosystemtechnik und Nanotechnologie. Zu den Produkten gehören manuelle und vollautomatisierte Fotolithographieanlagen, Wafer Bonder und Inspektionssysteme, die sowohl für … Deutsch Wikipedia
Nemotek Technologie — Type Private Industry Semiconductor Founded 2008 Headquarters Morocco … Wikipedia
Корпусирование ИС — Ранняя советская микросхема К1ЖГ453 Корпусирование интегральных схем завершающая стадия микроэлектронного производства, в процессе которой полупроводниковый кристалл устанавливается в корпус. Обычно состоит из этапов прикрепления крис … Википедия
Silicon on insulator — technology (SOI) refers to the use of a layered silicon insulator silicon substrate in place of conventional silicon substrates in semiconductor manufacturing, especially microelectronics, to reduce parasitic device capacitance and thereby… … Wikipedia
